.
home
about
products
distributors
support
application request form
contact
MEMS distributions in Israel
Application Request Form
Personal Information
:
Name
:
Title:
Company:
Phone:
Fax:
Substrate Information
:
Product Type:
Multi Chip Module
Single Chip Module
Number of Components per Unit:
Substrate Material:
Metal
Ceramic
PCB
Silicon
Glass
Other
Substrate Presentation:
Lead Frame
Snapstrate
Strip
Carrier
Singulated
Number of Units per Substrate:
Dimensions:
w [Inch]:
w [Inch]:
w [Inch]:
Component Information
:
W [mil]
L [mil]
T [mil]
Material
Dimensions:
Die Attach Technology:
Thermally Cured Adhesive
Solder Reflow
UV Cured Adhesive
Eutectic
Other
Diam. [mil]
Height [mil]
Material
Bump Dimensions:
Required Placement Accuracy:
X [mil]
Y [mil]
Theta [deg]
BLT [mil]
Required Throughput [UPH]:
Additional Information:
Copyright @ 2008. MicroAssembly Technologies, Ltd.
All Rights Reserved.