MAT specializes in providing turn-key solutions for most advanced die attach applications. Our machines perform MCM and Flip Chip processes for most complex assemblies. Should your application be Eutectic or Adhesive based die attach, our machines will handle it with high accuracy and yield.
	Please visit us at the Semicon West 2008 trade show in San Francisco. We will be presenting our Model 6400 High Accuracy Die Attach System in booth #7125A. We are happy to introduce our new partners in the world-wide sales and support organization. Please visit the new MEMS Component and Technology page in our web site. MAT is proud to announce the release of the Magazine to Magazine configuration of Model 6400 High Accuracy Die Attach System. The new Ultrasonic upgrade kit extends the capabilities of our die attach systems and allows performing Eutectic and Gold to Gold interconnect applications. For details please contact our sales representative in your area.		Die Attach

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