Please visit us at the SMTshow 2010 in Nuremberg, Germany. We will be presenting our Model 6400 High Accuracy Die Attach System in Hall A7, booth #538.

Please visit us at the Semicon West 2010 trade show in San Francisco. We will be presenting our Model 6400 High Accuracy Die Attach System in booth #5256 in the North Hall.

We are pleased to inform you that MAT has moved to a new location. Please click "Contact" for the new address.

We are happy to introduce our new partners in the world-wide sales and support organization.

Please visit the new MEMS Component and Technology page in our web site.

MAT is proud to announce the release of the Magazine to Magazine configuration of Model 6400 High Accuracy Die Attach System.

The new Ultrasonic upgrade kit extends the capabilities of our die attach systems and allows performing Eutectic and Gold to Gold interconnect applications.

For details please contact our sales representative in your area.